Product Summary

The TMS320C6415DGLZ is a DSP. It is the highest-performance fixed-point DSP generation in the TMS320C6000 DSP platform. The TMS320C6415DGLZ is based on the second-generation high-performance, advanced VelociTI very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI). The TMS320C6415DGLZ is an excellent choice for wireless infrastructure applications.

Parametrics

TMS320C6415DGLZ absolute maximum ratings: (1)Supply voltage ranges: CVDD: -0.5 V to 1.5 V; DVDD: -0.5 V to 4.4 V; (2)Input voltage ranges: (except PCI), VI: -0.5 V to 4.4 V (PCI), VIP: -0.5 V to DVDD + 0.5 V; (3)Output voltage ranges: (except PCI), VO: -0.5 V to 4.4 V (PCI), VOP: -0.5 V to DVDD + 0.5 V; (4)Operating case temperature ranges, TC: (default) 0 to 90℃; (5)Storage temperature range, Tstg: -65 to 150℃.

Features

TMS320C6415DGLZ features: (1)1.67-/1.39-/1.17-/1-ns Instruction Cycle; (2)600-/720-/850-MHz, 1-GHz Clock Rate; (3)Eight 32-Bit Instructions/Cycle; (4)Twenty-Eight Operations/Cycle; (5)4800, 5760, 6800, 8000 MIPS; (6)Fully Software-Compatible With C62x; (7)C6414/15/16 Devices Pin-Compatible; (8)Extended Temperature Devices Available; (9)Byte-Addressable (8-/16-/32-/64-Bit Data); (10)8-Bit Overflow Protection; (11)Bit-Field Extract, Set, Clear; (12)Normalization, Saturation, Bit-Counting; (13)VelociTI.2 Increased Orthogonality; (14)Sixteen General-Purpose I/O (GPIO) Pins; (15)Flexible PLL Clock Generator; (16)IEEE-1149.1 (JTAG) Boundary-Scan-Compatible; (17)532-Pin Ball Grid Array (BGA) Package (GLZ and ZLZ Suffixes), 0.8-mm Ball Pitch; (18)0.09-μm/7-Level Cu Metal Process (CMOS); (19)3.3-V I/Os, 1.1-V Internal (600 MHz); (20)3.3-V I/Os, 1.2-V Internal (720/850 MHZ, 1 GHz).

Diagrams

TMS320C6415DGLZ block diagram

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